Patents
Patent #5,236,117 - Impact Solder Method.
Patent #5,367,766 - Ultra High Density Integrated Circuit Packages Method
Patent #5,369,056 - Warp-Resistant Ultra-Thin Integrated Circuit Fabrication Method
Patent #5,369,058 - Warp-Resistant Ultra-Thin Integrated Circuit Fabrication Method
Patent #5,446,620 - Ultra High Density Integrated Circuit Packages
Patent #5,475,920 - Method Of Assembling Ultra High Density Integrated Circuit Packages
Patent #5,498,906 - Capacitive Coupling Configuration For An Integrated Circuit Package
Patent #5,550,711 - Ultra high density integrated circuit packages
Patent #5,581,121 - Ultra high density integrated circuit packages molding technique
Patent #5,588,205 - Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails
Patent #5,592,364 - High density integrated circuit module with complex electrical interconnect rails
Patent #5,873,844 - Method and Apparatus for Numbing Tissue Before Inserting a Needle
Patent Pending - TriTrack Modal Monorail Mass Transit System
Patent Pending - Method and Apparatus for Recording Multiple Perspective Images
Patent Pending - Apparatus for Electronically Programmable Speed Limiting